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Chipbond, KYEC team up for power IC packaging and testing

Olivia Hu, Taipei; Jessie Shen, DIGITIMES Asia Thursday 3 March 2011 0

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum of understanding (MOU) to jointly provide customers with turnkey packaging...

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