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Chipbond gearing up to expand capacity for 12-inch wafers

Olivia Hu, Taipei; Jessie Shen, DIGITIMES Asia Thursday 3 March 2011 0

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to company chairman Fei-Jain Wu.

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