UMC buys equipment for 3D IC manufacturing

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia Thursday 7 April 2011 0

United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment from subsidiary Hong Bao Technology (transliterated from Chinese), which designs and develops through silicon via (TSV) and other 3D...

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