Singapore IME, UMC team up to develop TSV for BSI sensors

Jessie Shen, DIGITIMES, Taipei Wednesday 6 June 2012 0

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon via (TSV) technology for backside-illuminated CMOS image sensors (B...

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