ASE, SPIL to stop ramping copper wirebonding capacity

Ingrid Lee and Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Thursday 31 January 2013 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising utilization rates at existing copper wire-bonding lines will be a...

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