Chipbond ramping up testing capacity for advanced driver ICs

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 18 June 2013 0

Chipbond Technology is ramping up testing capacity for advanced LCD driver ICs in response to rising demand for high-end smartphones and other mobile devices with higher resolution displays, according to Fei-Jain Wu, chairman of the Taiwan-based driver...

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