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ChipMOS to expand capacity for LCD driver ICs, says chairman

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Monday 24 June 2013 0

Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall production capacity for LCD driver ICs will rise more than 30% within...

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