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UTAC bolsters QFN package portfolio

Press release; Jessie Shen, DIGITIMES Asia Tuesday 7 April 2015 0

UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and a side lead plating (SLP) process that improves QFN...

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