New XMC memory fab to break ground at end-March, says DRAMeXchange

Jessie Shen, DIGITIMES, Taipei

Mar 22, 2016, 13:59 0

Ground-breaking for Wuhan Xinxin Semiconductor Manufacturing's (XMC) new memory fab in China is set to begin at the end of March, according to DRAMeXchange. The fab is expected to enter production in early 2018, and the initial production will be for 3D NAND...

The article requires paid subscription. Subscribe Now

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required