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Fujian Jin Hua to break ground for new DRAM fab in mid-July, say reports

Jerry Yang, Taipei; Jessie Shen, DIGITIMES Asia Monday 11 July 2016 0

Fujian Jin Hua Integrated Circuit will break ground for a new 12-inch wafer fab on July 16, according to media reports in China. The facility will be engaged in the manufacture of DRAM products using production technology developed by Taiwan's United...

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