ASE lands FOWLP packaging orders from Infineon, says paper

Commercial Times, May 24; Steve Shen, DIGITIMES Asia Wednesday 24 May 2017 0

Advanced Semiconductor Engineering (ASE) has reportedly secured orders for providing fan-out wafer-level packaging (FOWLP) service for Infineon Technologies' power management (PWM) chips, according to a Chinese-language Commercial Times repo...

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