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Toshiba develops 3D flash memory with TSV technology

Jessie Shen, DIGITIMES, Taipei Friday 14 July 2017 0

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started...

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