ASE, Cadence deliver SiP EDA solution

Jessie Shen, DIGITIMES, Taipei Friday 2 February 2018 0

Advanced Semiconductor Engineering (ASE) and Cadence Design Systems have collaborated to release a system-in-package (SiP) EDA solution that addresses the challenges of designing and verifying fan-out chip-on-substrate (FOCoS) multi-die packages, according...

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