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ChipMOS looks to COF packaging, automotive electronics for 2019 growth

Julian Ho, Hsinchu; Jessie Shen, DIGITIMES Asia Tuesday 18 December 2018 0

Chip-on-film (COF) packaging demand for panel-use driver ICs, demand for memory chips including niche-market DRAM and automotive NOR flash, and demand for automotive touch and display driver integration (TDDI) chips will boost revenues at ChipMOS Technologies...

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