Speculation has been circulating in the chipmaking market that AMD and MediaTek are in talks to form a joint venture that will be dedicated to developing SoC solutions combining Wi-Fi, 5G and high transmission technologies for notebook applications.
The planned JV is expected to bring in a closer tie between AMD, which is striving to further grow its notebook processor market share, and MediaTek, which has its expertise in wireless connectivity chips, according to sources at notebook makers.
The JV between AMD and MediaTek is expected to roll out its first SoC solution with integrated Wi-Fi, 5G and high-speed transmission chips in 2024, the sources indicated. The solution designed for high-speed wireless and wired data transmissions will be among the key features of AMD's comprehensively enhanced notebook processor platform, the sources said.
The JV may also sell its SoC solutions to third parties, the sources noted.
Through its JV with MediaTek, AMD will be able to gain a thorough understanding of Wi-Fi 6 and related chip integration designs, and the status of the available chips shipped and manufacturing costs, the sources said. Meanwhile, MediaTek with its Wi-Fi 6 chip solutions will also be able to expand substantially its presence in the notebook segment, the sources indicated.
AMD has responded saying it does not comment on market speculation, while MediaTek denied it.
AMD and MediaTek already started some form of cooperation in 2020, with the former adopting the latter's Wi-Fi 6 solutions in its notebook chip platform.
