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HannStar Board to increase shipment proportions for HDI, multi-layer PCBs

Jay Liu, Taipei; Adam Hwang, DIGITIMES Asia Monday 15 November 2021 0

HannStar Board president Tao Cheng-kuo. Credit: DIGITIMES

PCB maker HannStar Board is making efforts to increase the proportion of total shipment volume for HDI (high density interconnect) and multi-layer boards, according to company president Tao Cheng-kuo.

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