中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    China approves DeepSeek's Nvidia H200 chip purchase, but conditions still pending
    12min ago
    ASML gains from rising EUV demand and US chip spending
    27min ago
    ASIC server demand boosts Taiwan's high-end CCL shipments
    49min ago
    Home Research Research insights

    Samsung creates advanced packaging department; Chinese makers keen on building 8.6G panel line; Huawei AITO M7 electric SUV unveiled

    Tom Lo, DIGITIMES Research, Taipei 0
    The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please sign in if you wish to continue.

    Introduction

    Related stories
    Samsung's strategic overhaul: New business control tower and development units unveiled
    Huawei Device to cooperate with CATL in EV business
    Tags
    Advanced Packaging Asia enterprises automakers automotive BOE BYD CATL CSOT Digitimes Research equipment Huawei Hyundai IC design IC packaging IGZO Kia LiDAR packaging panel Samsung
    KLA
    BIZ FOCUS
    Jan 30, 12:05
    Taiwan's Tron Future Tech to Debut Advanced Drone Interception and AI-Guided Anti-Armor Solutions at Singapore Airshow 2026
    Friday 30 January 2026
    The Future of Online Gaming Entertainment
    Friday 30 January 2026
    From Shenzhen to Global Opportunity: The BIWIN Mini SSD Ecosystem Application Seminar
    Wednesday 28 January 2026
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Special Report