CONNECT WITH US

TSMC to boost advanced packaging capacity by 2026

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia 0

TSMC CEO CC Wei at the foundry house's tech forum in Taiwan on August 30. Credit: DIGITIMES

TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization of its 3D SoIC (system on integrated chips) technology.

The article requires paid subscription. Subscribe Now