Topco Scientific, which mainly distributes photoresist, silicon wafers and CMP slurry products to foundry houses, is looking to actively develop its third-generation semiconductor business and deepen its presence in the segment of advanced packaging materials.
At Semicon Taiwan 2022 from September 14-16, Topco will have a third-generation semiconductor and 5G applications section to showcase: GaN-on-QST wafers for high-frequency components and high voltage devices (over 650V); quartz cloths featuring low dielectric loss; high dimensional stability and high heat-resistance; and SLK films with low dielectric properties and high adhesiveness. It aims to tap the growing business opportunities for 3rd-gen semiconductor and EV applications, according to company sources.
In line with the world's carbon reduction and energy saving trends, the company will highlight a circular economy section to exhibit solutions supporting green industries, including 100% waste water recycling and zero emission technology, ammonia nitrogen wastewater treatment, cleanroom construction, and corporate CFV (carbon footprint verification) services.
Topco said it will also display comprehensive solutions to the semiconductor supply chains, covering front-end wafer manufacturing, advanced backend packaging and testing, and semiconductor integration services.
In the field of semiconductor wafer manufacturing, Topco continues to enhance the supply of silicon wafers, furnace tube quartz and CMP slurry used in the diffusion process, thin films and etching-use specialty chemicals, as well as EUV and DUV photoresists, photomask substrates, photomask protection films, which will also be part of its exhibits at the upcoming event.
Among its advanced packaging solutions to be showcased are temporary high-heat-resistant fixing tapes, packaging materials that provide good electrical insulation and moisture resistance for semiconductor components, high-performance thermal conductive films, thermal conductive tapes, thermal dissipation gaskets and modules, and insulating gaskets.
At the TechXPOT to be held alongside the show, the company said it will unveil a spate of new technologies and materials, including low porosity coating technology for semiconductor parts, corrosion-resistant porosity reducing materials, and mass transfer Cu micro pin for replacing solder ball in advanced packaging.
