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Tuesday 29 September 2026
RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Friday 25 September 2026
Singapore brands its chip sector as it tries to move up from manufacturing
Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the...
Thursday 24 September 2026
AI drives Episil GeSi, PMIC growth

Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth...

Wednesday 23 September 2026
Episil says AI demand marks structural shift in semiconductor epitaxy
Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is...
Tuesday 22 September 2026
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers...

Tuesday 22 September 2026
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC,...

Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...

Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...

Friday 18 September 2026
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...