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Thursday 11 June 2026
Wistron ITS rebrands as WITS to scale chip and AI engineering in software-hardware integration pivot
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of...
Thursday 11 June 2026
PCIM 2026: Why the Silicon survival, physics, and the AI vortex are forcing reality check

While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric...

Wednesday 10 June 2026
Infineon and VinRobotics sign partnership to advance humanoid robot development
Infineon Technologies and Vietnam's VinRobotics have agreed to collaborate on humanoid robots, a move that could shape how future machines are designed, manufactured, and deployed...
Wednesday 10 June 2026
Taiwan AI industry plan targets silicon photonics as new moat
The Taiwanese government has launched an AI infrastructure initiative aiming to further strengthen its semiconductor industry prowess by leveraging silicon photonics (SiPh) to form...
Tuesday 9 June 2026
India's NoPo targets advanced materials gap in chip supply chain
India's semiconductor push is creating an opening for companies outside the traditional chipmaking chain, including advanced materials suppliers that could serve electronics, sensor,...
Monday 8 June 2026
Exclusive: The semiconductor battle behind AI data centers and EVs
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
Monday 8 June 2026
Hitachi and Intel strike collaboration on physical AI and industrial infrastructure
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used...
Friday 5 June 2026
AI energy demand drives a shift to vertical power delivery and smaller modules
As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the...
Thursday 4 June 2026
Exclusive: How China's subsidized SiC boom is driving global prices to the floor
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
Wednesday 3 June 2026
GlobalFoundries completes acquisition of Synopsys' ARC processor IP business to build physical AI platform
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary,...
Tuesday 2 June 2026
Intel CEO Lip-Bu Tan anchors AI comeback on 18A, x86, and Taiwan ties at Computex 2026
Intel CEO Lip-Bu Tan used his Computex 2026 keynote in Taipei to frame Intel's AI-era reset around execution, infrastructure, and deeper ties with Taiwan's PC and semiconductor supply...
Tuesday 2 June 2026
Power Integrations unveils 1700V GaN auxiliary PSU for AI data centers
Power Integrations (PI) has announced two ultra-thin, compact auxiliary power supply (PSU) reference designs built for 800VDC AI data centers. PI principal training engineer Jason...
Monday 1 June 2026
AI infrastructure hits copper limits, foundries lock down silicon photonics capacity through 2028
Generative AI is moving at a speed scaling past critical computation thresholds, initiating a shift from a "chip-centric to an interconnect-centric" architecture era. The physical...
Monday 1 June 2026
AuthenX targets CPO bottlenecks with detachable metalens FAU
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...