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    NEWS TAGGED SILICON
    Friday 4 September 2026
    CPO testing shifts to mid-stage to avoid costly failures, Chroma says

    Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

    Friday 4 September 2026
    MSScorps August revenue hits new high on silicon photonics gains
    MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
    Friday 4 September 2026
    CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
    To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
    Friday 4 September 2026
    Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
    Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
    Friday 4 September 2026
    Silicon Valley overflow fuels semiconductor boom in California's Capital Region
    A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning...
    Friday 4 September 2026
    Silicon photonics testing shift could reshape how CPO suppliers win business
    As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
    Friday 4 September 2026
    Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal
    Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models...
    Thursday 3 September 2026
    Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
    China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
    Thursday 3 September 2026
    China chip tool makers expand beyond import substitution at CSEAC 2026

    China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

    Thursday 3 September 2026
    Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
    Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Thursday 3 September 2026
    Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
    Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    IBM's quantum pitch to chip audience: bottleneck is now manufacturing
    IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...
    Wednesday 2 September 2026
    Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
    Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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