China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary,...
Intel CEO Lip-Bu Tan used his Computex 2026 keynote in Taipei to frame Intel's AI-era reset around execution, infrastructure, and deeper ties with Taiwan's PC and semiconductor supply...
Power Integrations (PI) has announced two ultra-thin, compact auxiliary power supply (PSU) reference designs built for 800VDC AI data centers. PI principal training engineer Jason...
Generative AI is moving at a speed scaling past critical computation thresholds, initiating a shift from a "chip-centric to an interconnect-centric" architecture era. The physical...
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging...
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure,...
Marvell Technology has said its custom silicon business and data center solutions are emerging as central pillars of its long-term growth strategy, driven by rising demand from hyperscale...
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that...
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain...
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
