The sharpest question on Nvidia's second-quarter call came a Bank of America analyst, who noted that OpenAI and Anthropic - both major beneficiaries of Nvidia's ecosystem investment...
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production...
Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing...
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
