As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to...
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum...
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
As the world's most powerful enterprise data centers undergo a massive migration to liquid cooling to support high-power artificial intelligence processors, a Silicon Valley chipmaker...
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning...
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models...
China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
