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Monday 3 August 2026
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
Monday 3 August 2026
Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
Monday 3 August 2026
Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

Sunday 2 August 2026
AWS chip business passes US$25 billion run rate; CEO Jassy says there is 'real chance' of selling Trainium outside AWS
Amazon's custom silicon business has reached an annual revenue run rate of more than US$25 billion and is growing at triple-digit percentages yearly, CEO Andy Jassy said on the company's...
Saturday 1 August 2026
Thintronics wins proposed US CHIPS incentives for advanced substrate technology
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
Friday 31 July 2026
Apple targets AI subscription revenue as Cook exits and Ternus inherits next growth strategy
Apple is positioning AI as the foundation of its next growth phase, combining a privacy-focused AI strategy with expanded US semiconductor sourcing to support future products and services...
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026
CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
Thursday 30 July 2026
Microsoft's AI buildout: 88 new data centers, broader model catalog, silicon gains

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined...

Thursday 30 July 2026
GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026
Qualcomm to supply compute chips for BMW's next-gen vehicles through 2030s
Qualcomm Technologies and BMW Group have signed a long-term agreement under which Qualcomm will supply compute silicon for BMW's next-generation digital cockpit and advanced driver...
Thursday 30 July 2026
Marvell opens expanded Bengaluru R&D hub, doubling India headcount

Marvell Technology has opened 100,000 square feet of additional semiconductor R&D space in Bengaluru and plans to double its India...

Thursday 30 July 2026
Qualcomm's push into data centers and cars signals a broader shift in chip strategy

Qualcomm is moving more aggressively into data centers and automotive technology, aiming to reduce its dependence on smartphones and...

Thursday 30 July 2026
Arm readies AGI CPU shipments, eyes 3Q stream in fiscal 2028

Arm Holdings is preparing its first self-designed data center CPU, the Arm AGI CPU, for shipments by the end of calendar 2026, and...