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Thursday 27 August 2026
Washington's silicon-anode bet tests whether battery innovation can break China's graphite grip
The years-long tug-of-war between the US and China has witnessed a head-on showdown over technological might, as stringent export controls and tightening restrictions continue to push...
Thursday 27 August 2026
Ligitek skips 800G, targets 1.6T silicon photonics
Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related...
Thursday 27 August 2026
Nvidia's answer to custom silicon is the half of the market that will never build any
The sharpest question on Nvidia's second-quarter call came a Bank of America analyst, who noted that OpenAI and Anthropic - both major beneficiaries of Nvidia's ecosystem investment...
Wednesday 26 August 2026
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Wednesday 26 August 2026
Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm
Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
Wednesday 26 August 2026
Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon
As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
Tuesday 25 August 2026
Anthropic bets on in-house chips, reshaping ASIC orders
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
Tuesday 25 August 2026
China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production...
Tuesday 25 August 2026
Infineon buys India-based C2i Semiconductors to bolster AI data center power systems
Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing...
Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
Monday 24 August 2026
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...