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    Friday 2 October 2026
    JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
    JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
    Friday 2 October 2026
    TSMC, NTU deepen R&D ties through nearly 50 projects a year
    National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
    Friday 2 October 2026
    CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era
    Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...
    Thursday 1 October 2026
    Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development
    Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
    Thursday 1 October 2026
    Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion
    Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September...
    Wednesday 30 September 2026
    Samsung Electro-Mechanics' disclosed 2026 supply agreements total US$2.6 billion as server demand surges
    Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion...
    Wednesday 30 September 2026
    GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
    GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
    Tuesday 29 September 2026
    RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
    RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...
    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
    Tuesday 29 September 2026
    Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
    In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
    Friday 25 September 2026
    Singapore brands its chip sector as it tries to move up from manufacturing
    Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the...
    Thursday 24 September 2026
    AI drives Episil GeSi, PMIC growth

    Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth...

    Wednesday 23 September 2026
    Episil says AI demand marks structural shift in semiconductor epitaxy
    Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is...
    Tuesday 22 September 2026
    Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

    China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers...

    Tuesday 22 September 2026
    YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

    China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC,...

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    Oct 2, 08:00
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
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    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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