Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first...
Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...
Taiwan-based materials analysis specialist Msscorps reported consolidated revenue of NT$545 million (US$18.24 million) for the second quarter of 2025, up 17.25% from the previous...
Under the Trump administration's ambition to restore US leadership in semiconductor manufacturing, GlobalWafers America (GWA) announced its partnership with Apple on August 7, 2025...
Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
Apple has pledged an additional US$100 billion to bolster US chip manufacturing, rare earth supply, and its domestic supply chain, as former President Trump announced a 100% tariff...
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
