Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid...
Prices for low-cost 6-inch silicon carbide (SiC) substrates, after years of capacity expansion and brutal price wars, are now showing clear signs of bottoming out in the second half...
In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its...
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...
Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September...
Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion...
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the...
