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Thursday 29 January 2026
Earnings call summary: Meta expects sharp rise in capex as AI capacity becomes strategic bottleneck
Meta is preparing for a steep increase in capital spending in 2026 as it scales AI infrastructure to support "personal superintelligence," signaling a longer-term roadmap centered...
Thursday 29 January 2026
UMC accelerates advanced packaging and silicon photonics development as AI drives demand
As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh)...
Wednesday 28 January 2026
Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

Tuesday 27 January 2026
The end of the copper age? Lightmatter builds an alliance to power the optical future

In a major coordinated push to reshape high-performance computing, Lightmatter has announced strategic collaborations with Global Unichip Corp....

Monday 26 January 2026
TAISIC Materials shifts focus to high-end SiC substrates
Facing intense price competition from Chinese manufacturers in the silicon carbide (SiC) substrate market, Kenmec Mechanical Engineering's subsidiary TAISIC Materials is pursuing a...
Monday 26 January 2026
China unveils flexible fiber chips, an alternative to traditional silicon architectures
As traditional silicon-based semiconductors approach physical and manufacturing limits, flexible and non-planar chip architectures are gaining attention as a new direction in global...
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Thursday 22 January 2026
SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation
Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively...
Thursday 22 January 2026
Taiwanese firms prepare for silicon photonics and CPO packaging opportunities as AI data center continues growth
As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent...
Thursday 22 January 2026
US-Taiwan tariff deal clears key uncertainty for chipmakers, says GlobalWafers chair
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agr...
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical...
Monday 19 January 2026
Optics manufacturers strengthen ties with semiconductor firms in silicon photonics race, Asia Optical among targets
Industry speculation about collaboration between optics manufacturers and semiconductor companies to bolster their silicon photonics (SiPh) capabilities is gaining ground. Following...
Thursday 15 January 2026
NIAR chair urges ITRI to take charge of applying research
National Institutes of Applied Research (NIAR) chairman Cheng-wen Wu has called on the Electronic and Optoelectronic System Research Laboratories (EOSL) of the Industrial Technology...
Thursday 15 January 2026
Taiwan accelerates drive to build silicon photonics ecosystem

Taiwan's government is stepping up cross-ministerial support to build a domestic silicon photonics ecosystem, with a focus on strengthening...

Thursday 15 January 2026
Jorjin integrates US and Europe supply chains to target smart glasses
Dan Cui, head of US business development at Jorjin Technology, stated that as a designer and system integrator for various augmented reality (AR) devices, the company must continuously...