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Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
Friday 11 September 2026
CIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
Jensen Huang bets Nvidia's next leg of growth on turning AI compute into an investable asset

Jensen Huang used a Goldman Sachs conference appearance to argue that the constraints on AI's build-out are expanding from silicon into...

Friday 11 September 2026
More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief
Microsoft's AI accelerator was never designed to compete with Nvidia. It was designed to run Microsoft's own inference workloads across its own fleet, and that scoping decision —...
Thursday 10 September 2026
ITRI to showcase 3.2T silicon photonics and AI data center cooling
Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration...
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
Apple's A20 Pro pushes mobile chips into the 2nm era — but AI may be the bigger disruption

For years, smartphone processors have competed through a familiar formula: faster CPUs, stronger graphics, and increasingly smaller...

Thursday 10 September 2026
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Qualcomm this week announced a multi-generation collaboration with Amazon to develop custom silicon for AI inference and high-performance optical connectivity for Amazon Web Services...
Thursday 10 September 2026
Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources
As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications,...
Wednesday 9 September 2026
China's up to 99.2% anti-dumping duty on Japan DCS boosts local chip material suppliers
China has imposed provisional anti-dumping measures on Japanese dichlorosilane (DCS), a semiconductor material used in thin-film deposition, potentially accelerating Chinese wafer...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...