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Friday 10 July 2026
Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Friday 10 July 2026
Mitsubishi Chemical, JSW ramp GaN substrate capacity for EVs and data centers

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture...

Friday 10 July 2026
TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor...

Thursday 9 July 2026
Infineon blocks Innoscience GaN products from US market after patent win

Infineon has secured a final US import ban against Innoscience after the US International Trade Commission's May 7 ruling was upheld...

Thursday 9 July 2026
Apple's expanded US$30 billion Broadcom deal signals deeper bet on US chip strategy and domestic manufacturing
Apple's decision to commit more than US$30 billion to Broadcom over the next several years carries implications that reach well beyond a single procurement contract — potentially...
Wednesday 8 July 2026
Msscorps posts record 2Q revenue on AI and chip testing demand

Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers...

Wednesday 8 July 2026
China eyes AI model curbs as tech rivalry moves beyond chips

For years, Washington and Beijing focused much of their tech rivalry on silicon. Now the front line may be moving to the AI models the...

Tuesday 7 July 2026
Broadcom and Apple extend custom chip deal through 2031
Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device...
Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...
Sunday 5 July 2026
CSCC advances carbon materials for AI data center BBU supply chain
CSCC is pushing its carbon materials, advanced carbon materials, and graphite blocks as a three-pronged strategy to target battery backup units (BBUs) for AI servers. Its advanced...
Thursday 2 July 2026
Taiwan automotive LED maker EOI readies Mexico ramp for humanoid robots and silicon photonics

Excellence Optoelectronics Inc. (EOI) expects double-digit growth in 2026 from a strong 2025 base, supported by robust automotive lighting...

Thursday 2 July 2026
Socionext to develop TSMC A14 chiplet for AI data center SoCs

Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project...

Wednesday 1 July 2026
Samsung, SK Hynix southwest fab plans put Gwangju's silicon photonics ambitions in focus
Samsung Electronics' and SK Hynix's planned memory investments in South Korea's southwest have mostly been viewed as a push to balance regional development and tap into local renewable...
Tuesday 30 June 2026
Samsung Electro-Mechanics targets AI server growth with MLCC talks, substrate push

Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...