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Thursday 30 July 2026
Qualcomm to supply compute chips for BMW's next-gen vehicles through 2030s
Qualcomm Technologies and BMW Group have signed a long-term agreement under which Qualcomm will supply compute silicon for BMW's next-generation digital cockpit and advanced driver...
Thursday 30 July 2026
Marvell opens expanded Bengaluru R&D hub, doubling India headcount

Marvell Technology has opened 100,000 square feet of additional semiconductor R&D space in Bengaluru and plans to double its India...

Thursday 30 July 2026
Qualcomm's push into data centers and cars signals a broader shift in chip strategy

Qualcomm is moving more aggressively into data centers and automotive technology, aiming to reduce its dependence on smartphones and...

Thursday 30 July 2026
Arm readies AGI CPU shipments, eyes 3Q stream in fiscal 2028

Arm Holdings is preparing its first self-designed data center CPU, the Arm AGI CPU, for shipments by the end of calendar 2026, and...

Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging

Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match...

Thursday 30 July 2026
India launches homegrown silicon photonics tools to widen access for researchers and industry

India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...

Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...

Tuesday 28 July 2026
From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies...
Monday 27 July 2026
Hitachi selected for Japan quantum computing project with Intel collaboration
Hitachi has been selected as the prospective implementation organization for a Japanese government-backed project to advance next-generation quantum computers, with Intel contributing...
Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Friday 24 July 2026
Samsung Electro-Mechanics wins US$200 million AI server capacitor order

Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global...

Friday 24 July 2026
STMicroelectronics lifts data center target as AI optical demand outruns supply, but margin recovery waits on 2027 reshaping
STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings...
Friday 24 July 2026
China's Xi'an Eswin tops 1 million monthly 12-inch wafer sales and output, targets 1.8 million capacity

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon...

Thursday 23 July 2026
Google bets bigger on AI infrastructure as demand signals grow stronger across the board
Alphabet's Q2 earnings call reveals a company doubling down on compute capacity, custom silicon, and frontier model development — while investors probe the limits of the...