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    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    6h 1min ago
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    6h 1min ago
    Apple reportedly seeks lower OLED panel prices through larger orders
    6h 1min ago
    Huawei and Apple foldable phones set off a supply chain rush in September
    6h 1min ago
    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    6h 1min ago
    NEWS TAGGED SILICON
    Wednesday 26 August 2026
    Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
    At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
    Wednesday 26 August 2026
    Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm
    Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
    Wednesday 26 August 2026
    Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon
    As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
    Tuesday 25 August 2026
    Anthropic bets on in-house chips, reshaping ASIC orders
    Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
    Tuesday 25 August 2026
    China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
    According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production...
    Tuesday 25 August 2026
    Infineon buys India-based C2i Semiconductors to bolster AI data center power systems
    Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing...
    Tuesday 25 August 2026
    Broadcom's debt push signals AI compute is becoming Wall Street asset class
    The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Friday 21 August 2026
    China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
    National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
    Thursday 20 August 2026
    Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

    One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

    Thursday 20 August 2026
    Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

    SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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