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Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Wednesday 16 September 2026
Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
Tuesday 15 September 2026
MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter

MediaTek has become the first merchant silicon vendor to announce a 2-nanometer smartphone processor, unveiling the Dimensity 9600 Pro...

Tuesday 15 September 2026
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy

The US Federal Communications Commission (FCC) recently updated its equipment authorization rules, prohibiting authorization of devices...

Tuesday 15 September 2026
HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant

HS Hyosung Energy Solution Korea, a joint venture formed by South Korea's HS Hyosung Group and Belgian materials leader Umicore, signed...

Tuesday 15 September 2026
Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company...
Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

Monday 14 September 2026
US finalizes anti-dumping and anti-subsidy duties on solar imports from India, Indonesia, and Laos
The US Commerce Department on September 11 issued final affirmative determinations in its anti-dumping and countervailing duty investigations of crystalline silicon photovoltaic cells...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial...

Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
Friday 11 September 2026
CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...