Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
As custom AI silicon proliferates alongside growing demand for heterogeneous compute, the ability to move and optimize workloads across different accelerators is becoming an increasingly...
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company...
The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
Wolfspeed has received a conditional commitment for up to US$1.5 billion in long-term financing from the US Department of War to expand domestic production of silicon carbide (SiC)...
Taiwanese OSAT provider Sigurd Microelectronics and its subsidiary Winstek Semiconductor held a joint investor briefing on October 6. President Charles Yeh reported that surging demand...
As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become...
The traditional market divide between the third-generation semiconductors gallium nitride (GaN) and silicon carbide (SiC) is seeing greater overlap in 2026, with SiC increasingly encroaching...
Marvell Technology is betting that the next phase of AI infrastructure growth will require substantially more networking and optical connectivity, raising its fiscal 2028 revenue outlook...
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
