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Monday 7 September 2026
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
Monday 7 September 2026
Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports
As the world's most powerful enterprise data centers undergo a massive migration to liquid cooling to support high-power artificial intelligence processors, a Silicon Valley chipmaker...
Monday 7 September 2026
Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Sunday 6 September 2026
Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
Saturday 5 September 2026
TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Friday 4 September 2026
CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026
MSScorps August revenue hits new high on silicon photonics gains
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Friday 4 September 2026
Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
Friday 4 September 2026
Silicon Valley overflow fuels semiconductor boom in California's Capital Region
A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning...
Friday 4 September 2026
Silicon photonics testing shift could reshape how CPO suppliers win business
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Friday 4 September 2026
Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal
Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models...
Thursday 3 September 2026
Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
Thursday 3 September 2026
China chip tool makers expand beyond import substitution at CSEAC 2026

China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

Thursday 3 September 2026
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...