The rise of AI data centers is fueling demand for co-packaged optics (CPO) and silicon photonics (SiPh), compelling optical communications firm Browave to fast-track its CPO development...
At a GTC media roundtable, when pressed on whether application-specific integrated circuits (ASICs) threaten Nvidia's AI dominance, CEO Jensen Huang didn't mince words.
The Malaysian government recently announced a technology licensing agreement worth US$250 million with silicon intellectual property (IP) powerhouse Arm. The deal aims to assist the...
Nvidia's preparedness to use silicon photonics (SiPh) technology signifies its swift integration into the cloud AI sector in a short period. Partners, including Broadcom, Marvell,...
Nvidia CEO Jensen Huang officially announced the Spectrum-X and Quantum-X silicon photonic (SiPh) network switches, enabling AI factories to connect millions of GPUs across different...
Infineon has announced its next-generation battery backup unit (BBU) roadmap for AI data centers, featuring a scalable lineup from 4kW to what it calls the world's first 12kW BBU...
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently...
The US has initiated a Section 301 investigation into China's mature semiconductor processes and third-generation silicon carbide (SiC) semiconductors. Supply chain operators state...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
CDIL Semiconductors and Infineon Technologies have signed a Memorandum of Understanding (MoU) to collaborate on power semiconductor solutions tailored to India's growing needs in...
Topco Scientific (TSC) anticipates that its operational apex will be achieved in 2025, as the demand for silicon wafers, photoresists, and other related materials has grown significantly...
Marvell Technology has unveiled its first 2nm silicon IP for advanced AI and cloud infrastructure. The silicon, fabricated using TSMC's 2nm process, is integral to the Marvell platform...
In recent years, the worldwide silicon carbide (SiC) and other compound semiconductors market has been hit by increased production capacity inside China's supply chain, leading to...
TSMC's silicon photonic (SiPh) co-packaged optics (CPO) technology is progressing swiftly, with recent market speculation suggesting that related production lines are expected to...
Apple has unveiled an ambitious plan to invest over US$500 billion in the US over the next four years—a move designed to supercharge American innovation, high-skilled manufacturing,...
