Mitsubishi Electric held a completion ceremony on October 1, 2025, for its new power semiconductor factory in Kumamoto Prefecture, Japan. The facility will produce silicon carbide...
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
Egis Technology Group's silicon intellectual property (IP) vendor InPsytech announced on October 1 that it has appointed industry veteran David Hsu—Arm's former FAE director—as...
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company...
Onsemi has announced an agreement to acquire rights to Aura Semiconductor's Vcore power technologies, including related intellectual property licenses. The acquisition, expected to...
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
As tech companies push the boundaries of next-generation edge AI devices like smart glasses, two major hurdles remain: weight and heat. These issues, often overlooked in a device's...
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
Taiwan is racing to advance its silicon photonics capabilities, aiming to develop high-efficiency 400Gbps optical modules within one to two years, according to the Ministry of Economic...
Cyient Semiconductors has entered a strategic partnership with US-based Anora, headquartered in Texas, to provide end-to-end semiconductor development solutions, from design to production...
