In a press release promoting the Strategic Material Summit scheduled to be held in September during the week of SEMICON Taiwan 2022, Terry Tsao, President of SEMI Taiwan and the association's global chief marketing officer, cited a SEMI report indicating that the overall semiconductor material market size is likely to grow 8.6% in 2022 and reach US$69.8 billion, a new record high.
The wafer material market alone will grow 11.5% to US$45.1 billion, while the packaging material market will increase by 3.9%, to US$24.8 billion, respectively. The semiconductor material market value is expected to exceed US$70 billion in 2023.
The scale of SEMICON Taiwan 2022 reached a 10-year high, according to the real-time data on SEMI Taiwan's official website. It is expecting to receive more than 50,000 visitors this year, with 700 exhibitors to showcase their products and services in 2,450 booths. Exhibitor number and booth scales increased by 30% and 60% respectively, from 2021, as the world gradually reopens to cross-border travel in the post-pandemic era.
During the four-day event (Sept 13-16), the topics to be covered in symposiums and workshops include advanced manufacturing, heterogeneous integration, compound semiconductor, auto chips, smart manufacturing, sustainability, semiconductor cybersecurity, and workforce.
Featured speakers participating in the SEMICON Taiwan 2022 include Bob Chen, General Manager of Foxconn Semiconductor Business Group; Hans Adlkofer, SVP of Infineon's Automotive Division; Yoshifumi Kato, CTO of Denso; Takeshi Kataoka, SVP and General Manager of Automotive Solution Business Unit at Renesas; Kai Beckmann, CEO of Merck; Raymond Pao, SVP of Business Solutions at HTC; Berthold Hellenthal, Strategic Semiconductor Management at Volkswagen, etc.
According to event highlights, TSMC, Intel, ASE, AMD, AUO and other industry leaders will discuss the latest advances in 2.5D/3D IC packaging solutions and advanced testing technologies at the Heterogeneous Integration Global Summit 2022, IC Forum, and Advanced Testing Forum.
Audi, Denso, Bosch, PixArt, Foxconn, Win Semiconductor and Qorvo will share innovative automotive technologies and help strengthen the network of design and manufacturing partners at the Global Auto Chips Executive Summit, MEMS & Sensors Forum, and Power and Opto Semiconductor Forum.
