IC packaging materials suppliers expect pick-up in demand for HPC substrates

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia Wednesday 22 February 2023 0

Credit: DIGITIMES

IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize in the second quarter of the year, according to industry source...

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