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Home Tech Semiconductors

ASE advances fan-out PoP technology

Jessie Shen, DIGITIMES Asia Thursday 16 March 2023 0

Credit: DIGITIMES

Advanced Semiconductor Engineering (ASE), a subsidiary of ASE Technology Holding, has introduced its most advanced fan-out package-on-package (FOPoP) solution to reduce latency and provide exceptional bandwidth benefits for the dynamic mobile and networking...

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