NXP Semiconductors and TSMC have jointly announced their collaboration to deliver the industry's first automotive embedded MRAM in 16 nm FinFET technology.
As automakers transition to software-defined vehicles (SDV), they need to support multiple generations of software upgrades on a single hardware platform. Combining NXP's high-performance S32 automotive processors with fast and highly reliable next-generation non-volatile memory fabricated with 16nm FinFET technology creates the optimal hardware platform for this transition.
Compared to flash memories, MRAM can update 20MB of code in up to three seconds, minimizing the downtime associated with software updates and allowing automakers to eliminate bottlenecks caused by lengthy module programming times. In addition, MRAM provides a highly reliable technology for automotive mission profiles by providing up to one million update cycles, a level of endurance that is 10 times greater than flash and other emerging memory technologies.
SDVs enable automakers to deploy new features via over-the-air (OTA) updates, thereby extending the life of the vehicle and enhancing its functionality, appeal, and profitability. As software-based features become more prevalent in automobiles, the frequency of updates will increase, and the importance of MRAM's speed and durability will grow.
With its one-million cycle endurance, support for solder reflow, and 20-year data retention at 150 degrees Celsius, TSMC's 16FinFET embedded MRAM technology satisfies the stringent requirements of automotive applications.
Test vehicle samples are complete and in evaluation. Initial product samples are scheduled for lead customer availability in early 2025, according to the companies.
"The innovators at NXP have always been quick to recognize the potential of TSMC's new process technologies, especially for demanding automotive applications," said Kevin Zhang, senior VP of business development at TSMC. "We're excited to see our leading MRAM technology employed in NXP's S32 platform to enable the coming generation of software-defined vehicles."
"NXP's successful collaboration with TSMC spans decades and has consistently delivered high quality embedded memory technology to the automotive market," said Henri Ardevol, executive VP and GM of automotive processing at NXP. "MRAM is a breakthrough addition to NXP's S32 automotive solution portfolio supporting next-generation vehicle architectures."
