Tae-won Chey, CEO and chairman of SK, was quoted in recent South Korean media reports as addressing the market's growing fears about the AI bubble and the commercialization of sixth-generation HBM4 memory, which may occur sooner than planned.
The AI bubble has recently been the subject of significant controversy. Since AI is an irresistible trend, Chey recommended a simple solution: enhance technology capabilities.
Chey also stated that the goal of "realizing the commercialization of HBM4 ahead of schedule by 2025" is intended to protect South Korea's leadership in AI semiconductors. The remarks were made during his recent visit to SK Hynix's Icheon headquarters in Gyeonggi-do.
Sales of HBM3E have surged rapidly since the second quarter of 2024, with bit crossover over HBM3 expected in the third quarter, according to SK Hynix's most recent quarterly presentation materials. By 2024, HBM3E will account for more than half of the company's HBM bit capacity.
The HBM3E 12Hi memory from SK Hynix is also slated to enter mass production in the third quarter, with volume sales to clients beginning in the fourth quarter. The chip manufacturer will deliver the entire HBM2E-HBM3E 12Hi product line.
Chey has traveled the world to develop SK's AI value chain and modify its strategic direction. Although SK is presently focused on developing AI disciplines such as HBM and personal AI assistants, it is projected to grow into a company that delivers comprehensive AI solutions in the future, according to industry observers.
In June 2024, Chey visited Taiwan to meet with TSMC Chairman and CEO C. C. Wei. Chey also visited the US earlier this year to meet with Nvidia CEO Jensen Huang.
Chey paid another two-week tour to the US at the end of June, meeting with CEOs of OpenAI, Microsoft, Amazon, Intel, and other high-tech giants.
