India held SEMICON India 2024 from September 11-13. Tata Electronics shared progress on its wafer fab project, and NXP plans to double its investment in India.
Modi highlights silicon diplomacy in India's bid to become a global semiconductor powerhouse
India is hosting SEMICON India 2024 from September 11-13. During the event, Indian Prime Minister Narendra Modi reaffirmed India's commitment to becoming a semiconductor powerhouse by building a robust ecosystem, offering government support, and focusing on workforce readiness and international collaborations.
SEMICON India 2024 surpasses previous scales as global interest grows; NXP to double R&D efforts in India
India is hosting SEMICON India 2024 from September 11-13, with this year's event surpassing the scale of previous editions, driven by growing global interest in the country's expanding semiconductor market. NXP has also announced plans to double its R&D efforts in India, signaling increased investment in the region's innovation ecosystem.
PSMC approves technical transfer for India's first commercial wafer fab in three decades
Following the announcement of a technology transfer agreement with Tata Electronics—set to establish India's first commercial wafer fab in three decades—Powerchip Semiconductor Manufacturing Corporation (PSMC) has approved the provision of support services and technology authorization to Tata Electronics.
Tokyo Electron to supply equipment for Tata's chipmaking facilities, Lam Research starts new lab in India
Tokyo Electron, a leading semiconductor equipment provider from Japan, will supply chipmaking tools to Tata Electronics, which is constructing India's first wafer fab. Meanwhile, US-based Lam Research has initiated the development of a new lab in India, reflecting the growing opportunities for equipment suppliers as the country advances its chipmaking ambitions.
Tata Electronics signs MoU with ASMPT Singapore for ATMP venture
In a key move to advance its assembly, testing, marking, and packaging (ATMP) facilities in Vemagal, Karnataka, and Jagiroad, Assam, Tata Electronics has signed an MoU with ASMPT Singapore. This agreement focuses on collaborating to develop semiconductor assembly equipment infrastructure and solutions.
L&T Semiconductor Technologies partners with IBM for advanced IC design
According to an official press release, on September 10, L&T Semiconductor Technologies announced discussions to engage in an R&D collaboration with IBM to design advanced processors. The scope of this work could include processor design for edge devices and hybrid cloud systems, as well as for areas like mobility, industrial, energy, and servers.
India holds groundbreaking ceremony for first SiC module manufacturing facility
India-based RIR Power Electronics is setting up India's silicon carbide (SiC) manufacturing facility in Odisha, as the country is looking to expand incentive schemes beyond logical chip manufacturing to compound semiconductors and ATMP facilities.
