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China's top OSATs invest big in advanced packaging to compete globally

Amanda Liang; Willis Ke, DIGITIMES Asia Monday 30 September 2024 0

Credit: AFP

China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying R&D efforts on wafer-level and panel-level packaging solutions while...

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