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TCB packaging crucial in AI and HPC applications, says ASMPT

Annie Huang, Hong Kong; Kevin Wang, DIGITIMES Asia Wednesday 16 October 2024 0

Credit: DIGITIMES

Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend for generative AI and high performance computing (HPC) continues...

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