Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays...
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Innolux GM James Yang (L) and Chairman Jim Hung (R). Credit: DIGITIMES
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays...