CONNECT WITH US

Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

Amy Fan, Taipei; Elaine Chen, DIGITIMES Asia 0

Credit: AFP

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging technologies.

The article requires paid subscription. Subscribe Now