Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025...
The article requires paid subscription.
Subscribe Now
Tong Hsing's President Shao-Ping(Heinz) Lu. Credit: DIGITIMES
Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025...