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From cost burden to growth engine: AI revolutionizes advanced packaging

Joseph Chen, DIGITIMES Asia, Taipei Monday 11 August 2025 0

Credit: Digitimes

At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation interconnects are redrawing the semiconductor industry map...

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