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Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'

Flora Wang, Commentary; Charlene Chen, DIGITIMES Asia Friday 5 September 2025 0

Credit: DIGITIMES

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs) have seen advanced back-end packaging costs reach US$4.1 billion,...

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