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Research Insights: ASICs, packaging, and HBM reshape the AI chip race

Stella Weng, Analysis, Joseph Chen, DIGITIMES Asia, Taipei 0

Credit: Digitimes

The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized" phase shaped by three forces: the expansion of custom ASICs,...

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