12-inch SiC substrates poised for two-phase entry onto CoWoS packaging

Nuying Huang, Taipei; Sherri Wang, DIGITIMES Asia Tuesday 23 September 2025 0

Credit: DIGITIMES

After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips. Industry sources say 12-inch SiC substrates are being explored for...

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