Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business unit of Smiths Group, has announced a significant contract win with AMD, the US technology and computing company, to provide testing for AMD's semiconductor chips.
Smiths Interconnects' test sockets will be used to test AMD's latest AI Chip for its data centre 'Instinct' GPU application – a graphics processing unit that aims to accelerate deep learning, artificial neural networks and high-performance computing applications. The testing takes place during the manufacturing process to ensure that the chips will provide ultra-reliable and repeatable performance.
This latest win is an expansion of the relationship between Smiths Interconnect and AMD following a successful partnership in 2024 to test the company's previous AI chip programme.
Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with a world-class company such as AMD, and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."
Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.
As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown — and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.
Credit: Smiths Interconnect
Article edited by Joseph Tsai