Chenbro, a leading server chassis manufacturer, makes a strong presence at the 2025 OCP Global Summit from October 13 to 16 in San Jose, USA. Aligning with this year's theme, "Leading the Future of AI," Chenbro highlights three key business models: OTS (Off-The-Shelf), JDM (Joint Design Manufacturing), and OEM Plus services. Chenbro showcases strong capabilities from product design and mechatronic integration to global manufacturing, helping clients efficiently deploy AI and cloud server solutions and drive innovation in AI data centers.
Chenbro Makes a Major Debut at 2025 OCP Global Summit. Credit:Chenbro
Three Service Models Showcasing Design, Manufacturing, and Customization Strengths
At this years summit, Chenbro highlights its customer-centric strengths through integrated R&D and manufacturing to accelerate the deployment of next-generation computing platforms and support the rapidly growing AI and cloud markets:
OTS, with the slogan "Whatever's Inside, Chenbro Outside" offers flexible and customizable server chassis solutions that enable quick selection and deployment via product roadmap, demonstrating Chenbro's leadership in product design compatibility and adaptability.
JDM, embodying the philosophy "Agile R&D, Infinite Creation" focuses on agile development through global R&D deployment and the Joint Product Design Process (JPDP), while enhancing Design for Manufacturing (DFM) and validation services to deliver reliable, customized solutions.
OEM Plus, under the motto "Manufacturing Glocalization" promotes global manufacturing localization through its G-LCIM (Green, Low-Cost, Intelligent Manufacturing) implementation. This strategy enables the establishment of an efficient, flexible production system that ensures high quality and consistent delivery.
Chenbro CEO Corona Chen stated that amid the rapidly changing global industrial landscape, the company remains committed to its core strategy "Where our customers are, Chenbro is." Chenbro is actively advancing the localization of its global operations to enhance supply chain flexibility and operational resilience. The company's U.S. NCT facility is scheduled to officially commence operations in the fourth quarter, supporting local customers with front-end design and prototyping services. Meanwhile, its Malaysia mass-production plant is set to begin operations in the first half of next year, alongside ongoing plans for land acquisition and facility construction in Texas for another mass-production site. Looking ahead, Chenbro will continue to integrate automation and AI applications into its manufacturing processes to achieve lean and intelligent production, further strengthening its resilient global operations network.
Connecting the OCP Ecosystem with Win-Win Collaboration to Shape the AI Future
At this year's OCP event, Chenbro presented a comprehensive lineup of innovative products, including modular chassis designed for the OCP DC-MHS architecture, NVIDIA MGX architecture, and-making their debut-customized rack solutions. Together, these exhibits highlight Chenbro's capability to simplify system integration, enhance deployment flexibility, and empower customers to build the next-generation AI infrastructure.
OCP DC-MHS Solutions: Chenbro showcased its DC-MHS-compatible designs, underscoring strong support for new-generation CPU platforms and expanding applications for AI inference workloads.
GB300 & MGX Platforms: The GB300 system is engineered for large-scale AI model training, while the MGX 4U CX8 targets training and inference for small to medium AI models-demonstrating Chenbro's comprehensive coverage across AI computing demands.
Customized Rack Solutions: Beginning this year, Chenbro has expanded into the rack solution business, and at OCP unveiled its first concept rack that supports interchangeable OCP 21-inch and EIA 19-inch standards. Integrated with Chenbro's MGX and DC-MHS chassis, the display reflected the company's growing strength in providing complete mechanical system solutions.
In addition, Chenbro featured multiple AI and cloud server systems co-developed with global customers. Through these collaborations, Chenbro has solidified its role as a key enabler in the global transformation toward AI and cloud computing.
CEO Corona Chen led the Chenbro team to engage deeply with industry leaders. Credit:Chenbro
The OCP Global Summit remains a vital platform for innovation and collaboration. CEO Corona Chen led the Chenbro team to engage deeply with industry leaders such as NVIDIA, AMD, Intel, and major CSPs. Chenbro has evolved into a strategic partner with product definition capabilities, directly connecting with global cloud and AI customers while collaborating with ODMs and system integrators to meet market demands. This comprehensive market and design insight accelerates product development and promotes AI application innovation.
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Article edited by Joseph Tsai
