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JCET unveils Singapore blueprint for next-gen semiconductor packaging

Henry Hsu, Singapore; Levi Li, DIGITIMES Asia 0

Credit: DIGITIMES

Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the world's third-largest, JCET Group, is ramping up its global expansion...

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