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Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute

Jessica Tsai, Taipei; Emily Kuo, DIGITIMES Asia 0

Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM TC Bonder core technology of infringing its patents.

Hanwha Semitech has appointed Kim & Chang Law Firm as its legal representative. Because the case is ongoing, it is difficult to disclose specific details. However, the company has stated that the action is intended to protect core semiconductor equipment technology and to address illegal behavior. The technology is reportedly related to HBM3E TCBs.

Hanmi Semiconductor has issued a statement describing the lawsuit as baseless and a case of malicious preemptive litigation. It claimed that Hanwha Semitech's counteraction amounted to shameless false accusations.

Both Hanmi Semiconductor and Hanwha Semitech share SK Hynix as their major client, which currently dominates the HBM market. The dispute between Hanmi and Hanwha dates back to December 2024, when Hanmi first sued Hanwha. Hanwha's counterattack has only escalated the conflict between the two parties.

The outcome of the lawsuit will impact South Korea's HBM back-end equipment supply chain and the business performance of both Hanmi Semiconductor and Hanwha Semitech. If South Korean courts recognize Hanwha Semitech's patents, it could prohibit the manufacture and sale of equipment using the related patented technology. However, even if patent infringement is confirmed, the enforcement of such a manufacturing and sales ban would take effect after the ruling, and equipment already delivered would likely remain unaffected. However, the litigation could take several years to conclude, making it currently difficult to predict a clear winner.

Article edited by Jack Wu