Asia

REALTIME NEWS

Memory shortage reshapes smartphone SoC market as MediaTek and Qualcomm lose share

Tomorrow's Headlines

Lightelligence's HK listing signals China’s CPO push gaining momentum

Tomorrow's Headlines

Samsung highlights 4nm FinFET as AI chip demand rises

Tomorrow's Headlines

South Korea's OLED share rebounds to 68.7% in 2025

Tomorrow's Headlines

Taiwan and Europe push localised drone countermeasure tech

Tomorrow's Headlines

Low-Earth-orbit satellite market takes shape as Taiwan suppliers secure positions

Tomorrow's Headlines

Home Tech Semiconductors

STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

Henry Hsu, Singapore

Oct 30, 2025, 12:04 0

Credit: DIGITIMES

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

TechForum0520

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

marketing

MOST-READ
7 DAYS NEWS