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UMC and Samsung present advanced packaging trends at APDC 2025

Henry Hsu, Singapore; Emily Kuo, DIGITIMES Asia Friday 31 October 2025 0

Credit: DIGITIMES

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging. The forum invited experts from academia and industry, presenting...

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