Scientech's growth signals shift in semiconductor investment toward packaging and system integration

Monica Chen, Hsinchu; Jingyue Hsiao, DIGITIMES Asia Thursday 29 January 2026 0

Scientech CEO Eric Lee. Credit: DIGITIMES

As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced packaging and system-level integration. This shift is driving increased...

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