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SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI

Daniel Chiang, Seoul; Levi Li, DIGITIMES Asia 0

SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung focused on cross-domain semiconductor integration to address bandwidth...

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