ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

Flora Wang, Taipei; Levi Li, DIGITIMES Asia Wednesday 25 February 2026 0

Credit: DIGITIMES

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including ASE Holdings, SPIL and PTI Group, to accelerate advanced packaging...

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