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Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

Levi Li, DIGITIMES Asia, Taipei 0

Naoki Shinjo, SVP, head of advanced technology development unit, Fujitsu Research. Credit: Fujitsu

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform to Japan's Fujitsu, marking a concrete step from roadmap promise...

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