At Cheonan, Samsung is rewriting HBM's bonding playbook

Sherri Wang, DIGITIMES Asia, Taipei Mar 23, 2026, 08:09 0

Credit: Samsung

Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding technologies, as competition shifts from chip performance to packaging...

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