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Samsung Electro-Mechanics lifts FC-BGA prices on AI-driven shortage

Sherri Wang, DIGITIMES Asia, Taipei Apr 3, 2026, 12:44 0

Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA) substrates as demand from artificial intelligence (AI) servers and high-performance computing (HPC) applications continues to outpace supply, according to...

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