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ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029

Flora Wang, Taipei

May 11, 2026, 10:43 0

Credit: DIGITIMES

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand....

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