AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

, Taipei

May 22, 2026, 10:19 0

AMD is reportedly building a non-CoWoS AI chip packaging supply chain in Taiwan. Pictured is AMD CEO Lisa Su. Credit: DIGITIMES

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on an elevated fanout bridge (EFB) packaging ecosystem.

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